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CEVA teams with LG on smart 3D cameras

Israeli chipmaker CEVA Inc. (Nasdaq:CEVA) yesterday announced a partnership with Korean electronics giant LG to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications. The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of…